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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Binary to 1-8 Decoder (High)
MC10H162
The MC10H162 provides parallel decoding of a three bit binary word to one of eight lines. The MC10H162 is useful in high-speed multiplexer/ demultiplexer applications. The MC10H162 is designed to decode a three bit input word to one of eight output lines. The MC10H162 output will be high when selected while all other output are low. The enable inputs, when either or both are high, force all outputs low. The MC10H162 is a true parallel decoder. This eliminates unequal parallel path delay times found in other decoder designs. These devices are ideally suited for multiplexer/demultiplexer applications. * Propagation Delay, 1.0 ns Typical * Power Dissipation, 315 mW Typical (same as MECL 10K) * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible
L SUFFIX CERAMIC PACKAGE CASE 620-10 P SUFFIX PLASTIC PACKAGE CASE 648-08 FN SUFFIX PLCC CASE 775-02
LOGIC DIAGRAM
E0 2 E1 15 VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 A7 3 Q3 6 Q0 5 Q1 4 Q2
MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C
C 14 TRUTH TABLE INPUTS E0 E1 L L L L L L L L L L L L L L L L HX XH C L L L L H H H H X X B L L H H L L H H X X OUTPUTS A Q0 Q1 Q2 Q3 Q4 LHLLLL HLHLLL LLLHLL HLLLHL LLLLLH HLLLLL LLLLLL HLLLLL XLLLLL XLLLLL Q5 L L L L L H L L L L B9
13 Q4 12 Q5 11 Q6 10 Q7
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
0 Characteristic Power Supply Current Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH IinL VOH VOL VIH VIL tpd 0.7 0.8 tr tf 0.6 0.6 2.0 2.3 1.8 1.8 0.7 0.8 0.6 0.6 2.1 2.4 1.9 1.9 0.8 0.9 0.6 0.6 2.5 2.6 2.0 2.0 ns ns Min -- -- 0.5 Max 84 465 -- Min -- -- 0.5 25 Max 76 275 -- Min -- -- 0.3 75 Max 84 275 -- -0.735 -1.60 -0.735 -1.45 Unit mA A A Vdc Vdc Vdc Vdc
Q6 L L L L L L H L L L
Q7 L L L L L L L H L L
-1.02 -0.84 -0.98 -0.81 -0.92 -1.95 -1.63 -1.95 -1.63 -1.95 -1.17 -0.84 -1.13 -0.81 -1.07 -1.95 -1.48 -1.95 -1.48 -1.95
DIP PIN ASSIGNMENT
VCC1 E0 Q3 Q2 Q1 Q0 A VEE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 E1 C Q4 Q5 Q6 Q7 B
AC PARAMETERS
Propagation Delay Pins 7, 9, 14 Only Pins 2, 15 Only Rise Time Fall Time ns
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts. 3/93
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
(c) Motorola, Inc. 1996
2-253
REV 5
MC10H162
TYPICAL APPLICATIONS FIGURE 1 -- HIGH SPEED 16-BIT MULTIPLEXER/DEMULTIPLEXER
Control Selection
S0 S1 CR A B C D MC10H136
15 14 13 12 11 10 9 8
76543210
E1 C B A
MC10H164 D0
E1 C B A
MC10H164 D0
S0 S0 S1 S1 CR CR A B C D E1 C B A E0 MC10H162 E1 C B A E0 MC10H162 MC10H136
Start/Stop
15 14 13 12 11 10 9 8
76543210
MOTOROLA
2-254
MECL Data DL122 -- Rev 6
MC10H162
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MECL Data DL122 -- Rev 6
2-255
MOTOROLA
MC10H162
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V
9
-A-
16
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-256
*MC10H162/D*
MC10H162/D MECL Data DL122 -- Rev 6

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